Michael bettinger kl gates
Story continues Prism used the same outside counsel Kramer Levin. They sued in the same forum the District of Nebraska. The cases were before the same judge Strom, who is 92 years old and has been on the bench for 32 years. They asserted the same patents and more or less identical grounds for infringement.
But the outcomes were very different. Next up was Sprint. Cellular and Verizon, the lucky ducks, were numbers and They got to sit on the sidelines, their cases stayed, while their competitors duked it out with Prism. At issue: two Prism patents related to methods for managing access to protected information provided over certain untrusted networks. Prism wanted royalty payments, but did not ask for injunctive relief.
A fateful decision was formalized in May Sprint may not argue that Sprint does not infringe because the claims are allegedly invalid, the agreement stated. Phillips in an interview said the decision not challenge the patents validity was made before Sidley got involved. In retrospect, it was obviously a mistake and one with a bit of irony. The Federal Circuit ultimately ruled Prism s patents were invalid because they were abstract, noninventive ideas, per the U. Supreme Court s decision in Alice Corp.
Suffice to say, he was intimately familiar with the decision and how it might apply in other cases except the firm lawyers hands were already tied. Trial began in June and lasted seven days. In opening arguments, Bettinger tried to counter it. This is a case about Sprint's network and how it operates, he said, according to a court transcript. We did our own design. We didn't use others' design.
He also argued that Prism was trying to claim damages based on features that aren't even in the patent. You don't see any of those terms in the patent. That's not right. You can't claim damages for features you didn't invent. The jurors were not persuaded. Both sides appealed.
Prism wanted more money. Both sides lost. In March, the Federal Circuit affirmed the lower court s judgment. In May, it denied a petition to rehear the case and issued its mandate. All that was left was the inevitable hail Mary Supreme Court petition. But Prism and Kramer Levin wanted their money immediately, not after the cert petition. The condition of payment has been triggered namely, Sprint s appeal has been rejected by the Federal Circuit and the Mandate has issued, firm lawyers on June 9 wrote in a motion to lift the stay and collect Sprint s supersedeas bond.
It was an aggressive move, Phillips said. Most plaintiffs sit back and figure the money is safe whether they get it now or in three months after the Supreme Court in all likelihood declines to hear the case. And then, boom!
Two weeks later before Sprint had responded to Prism s motion the entire game changed. And consultants doubted whether the new and larger platform made sense for all attorneys, particularly practices that did not benefit from an international footprint and were more suited to a middle market firm. As you know, we over the years merged with some excellent U. How many clients have that as a need?
Kalis, however, said that five of the seven were non-equity partners, although he fell short of naming names. He said that the departures are more of a sign of the times in Big Law, than anything else.
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Due Methods for facilitating circuit board processing Patent number: Abstract: A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped and provided with standardized indexing holes to allow processing of circuit boards on processing equipment configured for lead frame-based processing.
Concave face wire bond capillary Publication number: Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
Due Apparatus and method for facilitating circuit board processing Publication number: Abstract: A circuit board carrier and method of using the same. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing. Wark, Michael J. Bettinger Concave face wire bond capillary Patent number: Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
Apparatus and method for facilitating circuit board processing Patent number: Abstract: A circuit board carrier and method of using the same. Due Concave face wire bond capillary Patent number: Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
Concave face wire bond capillary Patent number: Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame. The wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
Bettinger has filed for patents to protect the following inventions. Concave face wire bond capillary and method Patent number: Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
Concave face wire bond capillary and method Publication number: Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
Chapman, Michael J. Bettinger, Jennifer A. Due Methods for facilitating circuit board processing Patent number: Abstract: A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped and provided with standardized indexing holes to allow processing of circuit boards on processing equipment configured for lead frame-based processing.
Concave face wire bond capillary Publication number: Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
Due Apparatus and method for facilitating circuit board processing Publication number: Abstract: A circuit board carrier and method of using the same. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.
Wark, Michael J.
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